Mobile Phone Printed Circuit Board

Mobile Phone Printed Circuit Board

Type: Rigid Circuit Board Material: Fiberglass Epoxy Flame Retardant Properties: V0 Processing Technology: Gold Immersion Insulation Materials: Epoxy Resin Trademark: UPRIDE Specification: 100*100mm HS Code: 85340090 Dielectric: FR-4 Application: Communication Mechanical Rigid: Rigid Base Material: Fr4 Brand: Upride Transport Package: Vacuum Package Origin: China

Product Details

Key Specifications/Special Features:

PCB layers: 1 to 36 layers (standard)
PCB materials/types: FR4, aluminum, CEM1, super thin PCB, FPC/gold finger, HDI
Assembly service types: DIP/SMT or mixed SMT and DIP
Copper thickness: 0.5-10oz
Assembly surface finish: HASL, ENIG, OSP, immersion tin, immersion Ag, flash gold
PCB dimensions: 450x1500mm

 

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