HDI PCB control impedance PCB Buried vias PCB
Processing Technology: Delay Pressure Foil
Base Material: FR4
Insulation Materials: Epoxy Resin
Brand: Found
High Layer: 14
High Tg: 180
Copper: 1oz
Mask: Green
Silkscreen: White
Blind Hole: HDI 0.1mm
HDI Type: Drill1-2 Drill 1-3 Drill1-4 Dril 1-5
Line Width/Spacing: 3/3mil
Trademark: FASTECH
Transport Package: Carton
Specification: 64*40mm
Origin: Shenzhen
