The buried via is the hole made between inner layers used to interconnect the inner layer signal. It can not be visible from surface layers of top and bottom layer. Generally, they're often used on the mobile phone,PDA board etc.
Green Buried Via TG150 PCB is used in mobile phone, PDA boards, telecommunications, complext modules.
Design For Manufacture
This manufacturability guide provides an overview of various areas that printed circuit board designer may take into consideration on the fabrication possibility, manufacturing cost and reliability of their products. This DFM is divided into 6 parts for our readers. This is the section I.