Type: Rigid Circuit Board
Material: Fiberglass Epoxy
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Insulation Materials: V0
Surface Finish: HASL/ Enig/OSP
Min. Line Space: 0.075mm/ 3mil
Copper Thickness: 0.5oz - 10 Oz
Trademark: OEM
Specification: OEM size
HS Code: 8534009000
Dielectric: FR-4
Application: Communication
Mechanical Rigid: Rigid
Base Material: Copper
Brand: Upride
Min. Hole Size: 0.15mm
Min. Line Width: 0.075mm/3mil
PCB Thickness: 0.25mm - 6.0mm
Transport Package: Vacuum Bubble Package and Then to Carton Box
Origin: China
