Fr-4 Balck Solder Immer Gold With Counter Sink Holes Pcb

Fr-4 Balck Solder Immer Gold With Counter Sink Holes Pcb

Dielectric: FR-4 Base Material: Copper Brand: JC Plating: Enig, HASL(Lead Free), OSP, Tin, Gold Finger etc. Transport Package: Vacuum Packing with Desiccant, Export Carton Type: Rigid Circuit Board Material: Fiberglass Epoxy Flame Retardant Properties: V0 Processing Technology: Electrolytic Foil Insulation Materials: Epoxy Resin Laminate Materials: Fr-4,Fr-1,,Fr-2,Cem-1,Cem-3 Specification: UL, ROHS, REACH, SGS, TS16949, ISO14000

Product Details

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Direct Manufacturer Fr-4 Balck Solder Immer Gold With Counter Sink Holes Pcb

Our Services

One-Stop Service:
1. PCB manufacturing
2. Component sourcing
 Specification of PCB Manufacturing


Product Description

ItemSpecification\Parameter
PCB Layers1 to 18layers
PCB Max working panel area800mmx 508mm
Min board thickness4 layer: 0.40mm ;6 layer: 0.80mm ; 
8 layer: 1.00mm ;10 layer: 1.20mm
Min trace width0.1mm
Min spacing0.1mm
Min hole diameter0.2mm
Min Copper thickness in hole0.02mm
PTH size tolerance±2mil
NPTH size tolerance±1mil
Hole position tolerance±0.05mm
Surface treating process of inner layerBrown Oxide
Registration of inner layer to of inner layer±3mil(75um)
Min drilling diameter0.15mm
Min diameter of finished hole0.1mm
Accuracy of hole position±2mil(50um)
Tolerance of drilled slot±3mil(75um)
PTH hole copper thickness0.4-2mil(10-50um)
Image to image tolerance±3mil(75um)
Outer layer line width/space(min)±3mil/3mil(75um/75um)
Tolerance of etching±1mil(25um)


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