Parameter and data sheet
| Number of Layers | 4 |
| Board Type | Multilayer board |
| Board Size | 194.40 x 212mm=24UP |
| Board Thickness | 1.6mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 135ºC |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | 35 um (1oz) |
| Surface Cu thickness | 35 um (1oz) |
| Solder Mask Type and Model No. | LPSM, KSM-S6189BK31 |
| Solder Mask Colour | Black |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 14 um |
| Type of Silkscreen Ink | n/a |
| Supplier of Silkscreen | n/a |
| Color of Silkscreen | n/a |
| Number of Silkscreen | n/a |
| Mininum Trace (mil) | 7.9 mil |
| Minimum Gap(mil) | 5.5 mil |
| Surface Finish | Immersion gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| Thermal Shock Test | Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
| Drill table (mm) | T1: 1.500 |
| T2: 1.525 | |
