Parameter and data sheet
Number of Layers | 4 |
Board Type | Multilayer board |
Board Size | 194.40 x 212mm=24UP |
Board Thickness | 1.6mm +/-0.16 |
Board Material | FR-4 |
Board Material Supplier | ITEQ |
Tg Value of Board Material | 135ºC |
PTH Cu thickness | ≥20 um |
Inner Iayer Cu thicknes | 35 um (1oz) |
Surface Cu thickness | 35 um (1oz) |
Solder Mask Type and Model No. | LPSM, KSM-S6189BK31 |
Solder Mask Colour | Black |
Number of Solder Masks | 2 |
Thickness of Solder Mask | 14 um |
Type of Silkscreen Ink | n/a |
Supplier of Silkscreen | n/a |
Color of Silkscreen | n/a |
Number of Silkscreen | n/a |
Mininum Trace (mil) | 7.9 mil |
Minimum Gap(mil) | 5.5 mil |
Surface Finish | Immersion gold |
RoHS Required | Yes |
Warpage | 0.25% |
Thermal Shock Test | Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
Solderablity Test | Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
Drill table (mm) | T1: 1.500 |
T2: 1.525 |