4 Layer Rigid Flex PCB ITEQ KB IT180

4 Layer Rigid Flex PCB ITEQ KB IT180

Basic Info Model NO.: FD-027 Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Organic Resin Brand: Found HDI: Multilayer HDI Trademark: FD Transport Package: DHL&UPS&FedEx Specification: 30*45mm Origin: Shenzhen HS Code: 8534009000

Product Details


Basic Info

Model NO.: FD-027
Processing Technology: Delay Pressure Foil
Base Material: Copper
Insulation Materials: Epoxy Resin
Brand: Found
High Layer: 4
Copper Thickness: 1oz
Board Thickness: 1.2mm
Surface Finish: Immersion Gold
Min Width/Space: 3/3mil
Min Hole: 0.2mm
Mask: Green
Silkscreen: White
Trademark: FD
Transport Package: VACUUM PACKING
Specification: 83.14*91.4mm
Origin: Shenzhen
HS Code: 8534009000

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