It is a substrate composed of a Rigid part and a Flex part, and it is possible to connect a three-dimensional circuit by bending the Flex part.
Because connectors for intermodule connection are unnecessary, it is advantageous for miniaturization, maximizing SET space utilization makes it possible to improve design freedom.
General Features:
Flexibility (flexibility): 150,000 consecutive flexions, 50 temporary flexes
High density, thinner, various layer structure design etc
